Process FlowKorea Circuit is at the center of the smart world.

• Warehousing of raw materials

• Pattern Imaging (Inner)
• Lamination
• Drill
• Cu Plating
• Pattern Imaging
  (Outer)
• PSR
• Surface Treatment
• Router
• BBT
  (Electrical test)
• Inspection
• Packaging

Surface treatment

For oxidation prevention and easy SMT, the usable area (copper layer without ink coating) surface is coated.

The PCB surface that is connected to parts or makes a mechanical contact is plated or coated to improve its anti-abrasion, anti-corrosion and electrical conduction characteristics, as well its soldering, and to provide a glossy feel. The final surface treatment to make a coating layer is performed for that purpose. (AU plating, OSP)