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Cu plating
The product's surface and the inside of the hole are coated with copper to combine the inner and outer layers.
- Sub processes :
- Once the hole is drilled, Cu plating is used to make an electrical connection between each layer. Cu plating can be divided into chemical reaction based plating and electrical based plating. In general, using chemical plating, we can put a copper layer on the resin exposed during drilling and use electrical plating to obtain the proper thickness for stable electrical flows.
- Deburring
- When making a hole, this sub process can remove burrs and alien substances in the copper layer and improve the adhesion of copper plating on the copper layer’s surface.
- Desmear
- Use of chemicals to remove resin smears occurring during drilling.
- Electroless Cu plating
- Creating conductivity by coating copper on the inner wall of the hole.
- Electric Cu plating
- After chemical plating, using electricity, we can perform secondary plating to obtain the proper thickness.
- Figure
- Product photos
Process photos (main facility)
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Deburring
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Desmear
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Electroless Cu plating
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Electric Cu plating
