Process FlowKorea Circuit is at the center of the smart world.

• Warehousing of raw materials

• Pattern Imaging (Inner)
• Lamination
• Drill
• Cu Plating
• Pattern Imaging
  (Outer)
• PSR
• Surface Treatment
• Router
• BBT
  (Electrical test)
• Inspection
• Packaging

Drill

The process that connect electrical properties between inner and outer layers by using drill bit and laser to make hole.