Package SubstrateAdvanced technology that is shaping the future. Korea Circuit is creating the future of the digital world with its customers.

FCBGA

FCBGA connects the semiconductor chip and the package substrate with a flip chip bump. Fine align matching between layers is required due to miniaturization of substrate circuits and high multi-layers. In addition, large body size and multi-layer technology are required, especially for high performance computing. FCBGA is manufactured with a single unit flip chip substrate and is applied to servers and AI products.

• 
• 

Application

Automotive, Server, AI, Switching, Micro-processor

Sectional View

• 
• 

Specification