UT-CSP

Product Descriptions The product Advancing the Smart World

Package SubstrateAdvanced technology that is shaping the future. Korea Circuit is creating the future of the digital world with its customers.

UT-CSP(Ultra thin-CSP) refers to a CSP product with thickness of 0.12mm or less. Since the UT-CSP uses a thin layer that can reduce the overall package size, it is suitable for small, light weighted mobile devices. Recently, the UT-CSP is mostly used for MCP(Multi-Chip Package: multiple chips stacked for packaging). So, this term is often used to imply that it is an MCP Package Substrate.

Application

-. EEPROM. NAND Flash, power management, integrated passive networks, standard analog device
-. PRAM, LPDDR,ONEDRAM, NAND Flash
-. Mobile phone, PDAs, laptop PCs, disk drives, digital camera, MP3 player, GPS navigation devices, potable product

Sectional View

Specification

CSP_ UT-CSP Specification - Dex-scription(Patterning, Drilling, Via Fill (Dimple), Ball Pad Pitch, Solder Mask Tolerance, Thickness), Design
Item			Design
Patterning	Line/Space	MSAP	16 / 16
Patterning	Line/Space	Subtractive	25 / 25
Drilling	Via/Land	PTH (Laser)	65 / 150
Drilling	Via/Land	LVH (Laser)	50 / 110
Via Fill (Dimple)			Cu Fill (Max. 10um)
Ball Pad Pitch			0.35 mm
Solder Mask Tolerance			± 5 (DFSR)
Thickness	Cored	2Layer	80+/-7
	Cored	4Layer	140+/-20
	Coreless	2Layer	70+/-7
	Coreless	3Layer	90+/-15