Click to view the full text Click to view the main menu Click to view the website information
R&D / Technology The product Advancing the Smart World

HDI RoadmapKorea Circuit is at the center of the smart world.

HDI Roadmap - Line SPEC, Patterning, Ball Pitch, Thickness(10 layers), year(2023, 2024, 2025)
Year 2023 2024 2025
Line SPEC 2023year 30/40um, 2024year 35/35um, 2025year 20/20um
Patterning 2023year Tenting, 2024year Tenting, 2025year mSAP
Ball Pitch 2023year 0.35mmp, 2024year 0.32mmp, 2025year 0.30mmp
Thickness (10 layers) 2023year 550um, 2024year 450um, 2025year 400um