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R&D / Technology The product Advancing the Smart World

HDI RoadmapKorea Circuit is at the center of the smart world.

HDI Roadmap - Line SPEC, Patterning, Ball Pitch, Thickness(10 layers), year(2016, 2017, 2018, 2019, 2020, 2022)
Year 2016 2017 2018 2019 2020 2022
Line SPEC 2016year 30/40um, 2017~2018year 30/30um, 2019~2020year 25/25um, 2022year 20/20um
Patterning 2016~2017year Tenting, 2018~2020year MSAP, 2015~2016year SAP, 2022year SAP
Ball Pitch 2016~2017year 350um, 2017~2019year 300um, 2020~2022year 250um
Thickness (10 layers) 2016year 0.55mm, 2017~2018year 0.45mm, 2020~2022year 0.40mm