SIP(System In Package) indicates that a single independent function is achieved by placing or laminating multiple chips in a single package. This is a perfect system consisting of multiple chips including the microprocessor, and it has all the necessary parts. SIP has a short development periods and low cost, making it possible to produce small quantities of many different types of products. As well, since many different technologies and distinct parts are implemented on a single package, it is highly distinguishable from the SOC. It is also different from multi chip modules since it is developed for a standalone system.
-. RF/Wireless: Power amplifiers, baseband, transceiver modules, Bluetooth TM, GPS, UWB, etc. -. Consumer: Digital cameras, handheld devices, memory cards, etc. -. Networking/Broadband: PHY devices, line drivers, etc. -. Graphics processors -. TDMB -. Tablet PC -. Smart phone
|Patterning||Line/Space||Subtractive||30 / 30|
|Drilling||Via/Land||PTH||200 / 350|
|Ball/Land Pad Pitch||1.0 mmP|
|Via Fill Material (Plugging)||PHP-900 IR6|
|Additional Process||Etch-Back Process|
|Thickness||520 ± 40|