Click to view the full text Click to view the main menu Click to view the website information
R&D / Technology The product Advancing the Smart World

Status of Research CenterKorea Circuit is at the center of the smart world.

The Ramp;D headquarters of Korea Circuit are striving to develop the technology that can lead the entire PCB industry.

In addition, we have implemented the latest testing facilities to support technological development and improve our product technologies. Through academic/industrial collaboration and nationally funded projects, we are striving to develop the technologies that can lead the industry.

Research center photo

Research center status

  • Date of establishment: Nov 03, 1990
  • Korea Circuit research center
  • Address: 133-9(Seonggok-dong) Gangchon-ro Danwon-gu, Ansan-si, Gyeonggi-do
  • Research area: (electrical, electronics) PCB
  • Approval no.: 19901113
  • R&D head: Yang Deok Jin
  • # of materials: 35

Main history

1990
1990.11Established the R&D center.
1991~1998
PCB Research Union
– Completed development of the five R&D projects for the industry.
  • 1991.08 ~ 1992.07Developed the impedance board.
  • 1991.08 ~ 1993.11Developed the multi-layered PCB.
  • 1992.11 ~ 1995.10Developed the ultra precision thin layer PCB.
  • 1995.12 ~ 1997.11Developed the MCM-L PCB.
  • 1996.11 ~ 1998.10Developed the conductive PASTE PCB.
2005
2005.05Member of KPCA (Korea PCB Association)
2007~2024
Government funded projects (national projects)
  • 2007.07 ~ 2011.06Developed the next-generation multi-functional embedded SoP_L technology.
  • 2007.09 ~ 2008.08Developed the technology for semiconductor packages with the PCB having built
    in chips.
  • 2009.09 ~ 2011.08Improved mechanical/thermal reliability of the SiP Module.
  • 2010.06 ~ 2013.05Developed the next-generation ultra thin layer MCP PCB module/SiP embedded
    PCB module.
  • 2010.07 ~ 2012.06Developed the Rigid-Flexible photoelectric PCB integration technology.
  • 2011.11 ~ 2013.10Developed the highly integrated Hole Plugging Ink product.
  • 2013.11 ~ 2014.11Developed the thin layer capacitors for highly dielectric compounds based
    embedded PCB.
  • 2020.04 ~ 2023.12Developed the technology for producing a titanium drum electrode with a thickness of
    0.7 μm or more and a diameter of 3.5m for microcircuit
  • 2020.08 ~ 2022.12Developed the 4N class palladium materialization and high reliability palladium plating
    technologyfor semiconductor electronics industry from electronic scrap

R&D facility

15 cases other than the non destructive precision tester (X-Ray inspection equipment).