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Product Descriptions The product Advancing the Smart World

HDIAdvanced technology that is shaping the future. Korea Circuit is creating the future of the digital world with its customers.

Smart Phone/Tablet

In line with the trend of high functionality of mobile devices, our company is applying Build up Stack-via, Staggered via, Filled via & Fine Pitch to the manufacturing process for small/high density, high quality PCB.

Application

Smart Phone / Tablet

Sectional View

Specification

Smart Phone/Tablet Specification - No. of Layers, Base Material(Laminate), Base Material(Build up), Board Thickness, Min.Line Width, Min Line Spacing, Min. Mech. Drill Size, Min. Laser. Drill Size, Surface Treatment, Comment
No. of Layers 4~12L
Base Material(Laminate) FR-4, High Tg, Low Dk, Low CTE, Lower Df, RCC H/F
Base Material(Build up) FR-4, High Tg, Low Dk, Low CTE, Lower Df, RCC H/F
Board Thickness 0.3~1.6T
Min.Line Width 30um
Min Line Spacing 40um
Min. Mech. Drill Size 150um
Min. Laser. Drill Size 80um
Surface Treatment ENIG, OSP
Comment Stack Via, Staggered Via, Filled Via, Metal Cap