Process FlowKorea Circuit is at the center of the smart world.
- 1. Warehousing of raw materials
- Warehoused raw materials are released to each process after incoming inspection.
- 2. Pattern imaging(inner)
- The copper layer is corroded to form the circuit. The circuit is formed on the core of the inner layer. (exposure, development, corrosion)
- 3. Lamination
- Using heat and pressure, the inner layer core and the insulator are combined together.
- 4. Drill
- The process that connect electrical properties between inner and outer layers by using drill bit and laser to make hole.
- 5. Cu Plating
- The product's surface and the inside of the hole are coated with copper to combine the inner and outer layers.
- 6. Pattern imaging(outer)
- The copper layer is corroded to form the circuit. The circuit is formed on the core of the inner layer. (exposure, development, corrosion)
- 7. PSR
- Using non changeable ink, the non usable areas are coated.
- 8. Surface Treatment
- To prevent oxidation and support easy SMT, the usable area
(copper layer without ink coating) surface is coated.
- 9. Router
- Using bits, the panel is cut to the size desired by the customer.
- 10. BBT(Electrical test)
- Electrical test to verify circuit connections.
- 11. Inspection
- Process to check the product exterior and quality characteristics using visions and magnifiers
- 12. Packaging
- Vacuum packaging and fillers are used for shipping.
