Process FlowKorea Circuit is at the center of the smart world.
Lamination
Using heat and pressure, the inner layer core and the insulator are combined together.
- Sub processes :
- The inner layer’s PCB and the prepreg(P·P) and the copper layer are pressed and heated to melt and harden the prepreg, so that the copper layer and the inner layer’s PCB are attached together to form a multi-layer PCB.
- Oxide(Brown)
- The oxidation process involves chemical processing of the inner layer PCB’s copper area to create roughness on the surface, so that the insulator and the copper layer can be adhered to each other more firmly in the hot pressing process.
- 1st Lay-Up(Bonding)
- The preparation for the second layup. The core with the inner layer’s PCB and the prepreg are aligned to the proper inter layer locations to stack the product. In general, bonding is most frequently used.
- 2nd Lay-Up
- The preparation for pressing. The product after the 1st layup and the copper layer are combined with various tools to repeatedly stack them.
- Hot Press
- Using high heat/pressure, the prepreg is melted and hardened, so that the copper layer and the inner core are attached to form a multi-layer PCB.
- Figure
- Product photos
Process photos (main facility)
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Oxide
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1st lay up
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2nd Lay-up
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Hot press
