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R&D / Technology The product Advancing the Smart World

Package Substrate RoadmapKorea Circuit is at the center of the smart world.

Package Substrate Roadmap - Line SPEC, Patterning, Bump Pitch, Substrate Thickness, year(2023, 2024, 2025)
Year 2023 2024 2025
Line SPEC 2023year 12/12um, 2024year 9/12um, 2025year 8/8um(ETS)
Patterning 2023year MSAP ASAP ISAP, 2024year ETS
Bump Pitch 2023year 130um, 2024year 110um, 2025year 100um
Substrate
Thickness		 2023year 3L(90um),4L(120um). 2024year 3L(75um),4L(1100um). 2025year 3L(70um),4L(105um).