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Product Descriptions The product Advancing the Smart World

Package SubstrateAdvanced technology that is shaping the future. Korea Circuit is creating the future of the digital world with its customers.

FCBGA

FCBGA connects the semiconductor chip and the package substrate with a flip chip bump. Fine align matching between layers is required due to miniaturization of substrate circuits and high multi-layers. In addition, large body size and multi-layer technology are required, especially for high performance computing. FCBGA is manufactured with a single unit flip chip substrate and is applied to servers and AI products.

Application

Automotive, Server, AI, Switching, Micro-processor

Sectional View

Specification

FCBGA Specification - Dex-scription(Patterning, Drilling, Bump, Die Bump Type, Surface Treatment), Design
Dex-scription Design
Patterning Line/Space SAP 9 / 12
ISAP 9 / 12
Drilling Via/Land PTH 100 / 200
Laser 60 / 85
Bump PAD 95
SRO 70
Pitch 130
Die Bump Type SAC 305, Sn0.7Cu
Surface Treatment OSP+SOP, Immersion Tin