UT-CSP(Ultra thin-CSP) refers to a CSP product with thickness of 0.12mm or less. Since the UT-CSP uses a thin layer that can reduce the overall package size, it is suitable for small, light weighted mobile devices. Recently, the UT-CSP is mostly used for MCP(Multi-Chip Package: multiple chips stacked for packaging). So, this term is often used to imply that it is an MCP Package Substrate.
-.EEPROM. NAND Flash, power management, integrated passive networks, standard analog device -.PRAM, LPDDR,ONEDRAM, NAND Flash -. Mobile phone, PDAs, laptop PCs, disk drives, digital camera MP3 player, GPS navigation devices, potable product
| Item | Design | ||
|---|---|---|---|
| Patterning | Line/Space | MSAP | 20 / 20 |
| Subtractive | 30 / 30 | ||
| Drilling | Via/Land | PTH (Laser) | 65 / 150 |
| LVH (Laser) | 50 / 110 | ||
| Via Fill (Dimple) | Cu Fill (Max. 10um) | ||
| Ball Pad Pitch | 0.35 mm | ||
| Solder Mask Tolerance | ± 5 (DFSR) | ||
| Thickness | Cored | 2Layer | 80+/-7 |
| 4Layer | 140+/-20 | Coreless | 2Layer | 70+/-7 |
| 3Layer | 90+/-15 | ||
