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UT-CSP

UT-CSP(Ultra thin-CSP) refers to a CSP product with thickness of 0.12mm or less. Since the UT-CSP uses a thin layer that can reduce the overall package size, it is suitable for small, light weighted mobile devices. Recently, the UT-CSP is mostly used for MCP(Multi-Chip Package: multiple chips stacked for packaging). So, this term is often used to imply that it is an MCP Package Substrate.

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Application

-. EEPROM. NAND Flash, power management, integrated passive networks, standard analog device
-. PRAM, LPDDR,ONEDRAM, NAND Flash
-. Mobile phone, PDAs, laptop PCs, disk drives, digital camera, MP3 player, GPS navigation devices, potable product

断面図

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Specification