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Product Descriptions The product Advancing the Smart World

Package Substrate未来を創造する先端技術。コリアサーキットはお客様と共にデジタル世界の未来を作っていきます。

FCBGA

FCBGA connects the semiconductor chip and the package substrate with a flip chip bump. Fine align matching between layers is required due to miniaturization of substrate circuits and high multi-layers. In addition, large body size and multi-layer technology are required, especially for high performance computing. FCBGA is manufactured with a single unit flip chip substrate and is applied to servers and AI products.

Application

Automotive, Server, AI, Switching, Micro-processor

断面図

Specification

FCBGA Specification - Dex-scription(Patterning, Drilling, Bump, Die Bump Type, Surface Treatment), Design
Dex-scription Design
Patterning Line/Space SAP 9 / 12
ISAP 9 / 12
Drilling Via/Land PTH 100 / 200
Laser 60 / 85
Bump PAD 95
SRO 70
Pitch 130
Die Bump Type SAC 305, Sn0.7Cu
Surface Treatment OSP+SOP, Immersion Tin