In line with the trend of high functionality of mobile devices, our company is applying Build up Stack-via, Staggered via, Filled via & Fine Pitch to the manufacturing process for small/high density, high quality PCB.
Smart Phone / Tablet
| No. of Layers | 4~12L |
|---|---|
| Base Material(Laminate) | FR-4, High Tg, Low Dk, Low CTE, Lower Df, RCC H/F |
| Base Material(Build up) | FR-4, High Tg, Low Dk, Low CTE, Lower Df, RCC H/F |
| Board Thickness | 0.3~1.6T |
| Min.Line Width | 30um |
| Min Line Spacing | 40um |
| Min. Mech. Drill Size | 150um |
| Min. Laser. Drill Size | 80um |
| Surface Treatment | ENIG, OSP |
| Comment | Stack Via, Staggered Via, Filled Via, Metal Cap |
