本文へ 大メニューへ 下のサイト情報へ
Product Descriptions The product Advancing the Smart World

HDI未来を創造する先端技術。コリアサーキットはお客様と共にデジタル世界の未来を作っていきます。

Smart Phone

As mobile handsets switch to convergence types and small sizes, our company is applying Build up Stack-via, Staggered via, Filled via & Fine Pitch to the manufacturing process for small/high density, high quality PCB.

Application

Smart Phone / Mobile Phone

断面図

Specification

Mobile_ Smart Phone Specification - No. of Layers, Base Material(Laminate), Base Material(Build up), Board Thickness, Min.Line Width, Min Line Spacing, Min. Mech. Drill Size, Min. Laser. Drill Size, Surface Treatment, Comment
No. of Layers 4~12L
Base Material(Laminate) FR-4, High Tg FR-4, Halogen Free
Base Material(Build up) FR-4, RCC, High Tg FR-4, Halogen Free, etc
Board Thickness 0.3~1.6T
Min.Line Width 30um
Min Line Spacing 40um
Min. Mech. Drill Size 200um
Min. Laser. Drill Size 80um
Surface Treatment ENIG, OSP, Selective OSP
Comment Stack via, Staggered via, Filled via