As mobile handsets switch to convergence types and small sizes, our company is applying Build up Stack-via, Staggered via, Filled via & Fine Pitch to the manufacturing process for small/high density, high quality PCB.
Smart Phone / Mobile Phone
| No. of Layers | 4~12L |
|---|---|
| Base Material(Laminate) | FR-4, High Tg FR-4, Halogen Free |
| Base Material(Build up) | FR-4, RCC, High Tg FR-4, Halogen Free, etc |
| Board Thickness | 0.3~1.6T |
| Min.Line Width | 30um |
| Min Line Spacing | 40um |
| Min. Mech. Drill Size | 200um |
| Min. Laser. Drill Size | 80um |
| Surface Treatment | ENIG, OSP, Selective OSP |
| Comment | Stack via, Staggered via, Filled via |
