本文へ 大メニューへ 下のサイト情報へ
Product Descriptions The product Advancing the Smart World

Package Substrate未来を創造する先端技術。コリアサーキットはお客様と共にデジタル世界の未来を作っていきます。

FCCSP

FC-CSP(Flip Chip-CSP) means that the chip mounted in the PCB is turned over. Compared to the general CSP, the difference is that the connection between the semiconductor chip and the substrate is not wire bonding, but bumps. Since it does not require Wire-Bonding, it is much smaller than those products that go through the general wire bonding process. In addition, many chips and the PCB are connected at the same time, in contrast to wire bonding, which requires you to connect one at a time. Moreover, the connection length is much shorter than in wire bonding, so the performance can be improved.

Application

-. Smart phone
-. Lap top (Ultra thin notebook / Tablet PC)
-. Portable game device
-. Power/Analog IC drive
-. Control drive IC for portable electronic device

断面図

Specification

FCCSP Specification - Dex-scription(Patterning, Drilling, Bump, Die Bump Type, Surface Treatment), Design
Dex-scription Design
Patterning Line/Space SAP 9 / 12
MSAP 16 / 16
Drilling Via/Land PTH 75 / 180
Laser 65 / 125
Bump PAD 100
SRO 70
Pitch 130
Die Bump Type SAC 305, Sn0.7Cu
Surface Treatment ENEPIG, Selective OSP