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R&D / Technology The product Advancing the Smart World

Package Substrate Roadmap智能化的世界，其中有Korea Circuit。

Package Substrate Roadmap - Line SPEC, Patterning, Bump Pitch, Substrate Thickness, year(2016, 2017, 2018, 2019, 2020, 2022)
Year 2016 2017 2018 2019 2020 2022
Line SPEC 2016year 15/15um, 2017year 13/13um, 2018year 13/13um, 2019year 10/10um, 2020year 10/10um, 2022year 8/8um
Patterning 2016year MSAP, 2016~2017year SAP, 2018~2022year EPP(ETS)
Bump Pitch 2016~2019year 130um, 2020~2022year 100um
Substrate
Thickness		 2016year 2L(80um),3L(100um),4L(110um). 2017~2018year 2L(70um),3L(80um),4L(100um). 2019~2020year 2L(60um),3L(70um),4L(90um). 2022year 2L(55um),3L(65um),4L(85um)