The product Advancing the Smart World
| TRM | 2026 | 2027 | 2028 | |
|---|---|---|---|---|
| Layer Count | 12L | 12L | 16L | |
| Max. Board Thickness | 1.6mm | 1.6mm | 2.0mm | |
| Micro Via Configuration | 3Stack | 3Stack | Anylayer | |
| Line/Space | Cu Hoz | 50 / 75㎛ | 50 / 75㎛ | 50 / 50㎛ |
| Cu 1oz | 75 / 75㎛ | 75 / 75㎛ | 50 / 50㎛ | |
| Cu 1oz + Plating | 100 / 100㎛ | 100 / 100㎛ | 75 / 75㎛ | |
| BGA Pitch | 0.5mm | 0.5mm | 0.4mm | |
| Core Thickness | Min. 50㎛ | Min. 50㎛ | Min. 50㎛ | |
| Dielectric Thickness | Min. 45㎛ | Min. 45㎛ | Min. 40㎛ | |
| Micro Via (Via size / Land) | 100㎛ / 250㎛ | 100㎛ / 250㎛ | 90㎛ / 220㎛ | |
| Mechanical Drill (Hole / Land) | 200㎛ / 450㎛ | 200㎛ / 450㎛ | 150㎛ / 300㎛ | |
| Registration | Layer to Layer | ±85㎛ | ±75㎛ | ±60㎛ |
| Solder mask | ±30㎛ | ±25㎛ | ±25㎛ | |
| Controlled Impedance | Inner | ±10% | ±8% | ±8% |
| Outer | ±10% | ±10% | ±8% | |
| Solder Mask | Green, Black, Blue, Red, Yellow, White | |||
| Epoxy Fill material | IR-6P, Z2K, DX7 | |||
| Surface treatment | OSP, ENIG, ENEPIG, Silver, Tin, HASL | |||
